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ENCAPSULATION Datasheets, PDF

Descripción buscado : 'encapsulation' - Total: 65 (1/4) Page
Fabricante ElectrónicoNo. de piezavistaDescripción Electrónicos

PHOENIX CONTACT
2947828 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design.
2943521 Covering hood, for the contact and dust-protected encapsulation of the components, in green design.

Sangdest Microelectroni...
303DMQ600 High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance

List of Unclassifed Man...
SM2615FTR845 High temperature molded encapsulation

PHOENIX CONTACT
2948322 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design.
2946175 Covering hood, for the contact and dust-protected encapsulation of the components, in green design.

PANDUIT CORP.
D-300-01 CAP, SPLICE ENCAPSULATION

Sangdest Microelectroni...
87CNQ020 High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
201CNQ High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance

PHOENIX CONTACT
2947899 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design.
2944300 Covering hood, for the contact and dust-protected encapsulation of the components, in green design.

M.S. Kennedy Corporatio...
MSK4891_15 Proprietary Encapsulation Provides Near Hermetic Performance

AVAGO TECHNOLOGIES LIMI...
ASMT-QWBF-NKL0E High reliability package with enhanced silicone resin encapsulation

PHOENIX CONTACT
2943152 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design.
2946227 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design.
2947132 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. Height: 7.5 mm, width: 25 mm

Vishay Siliconix
WSCWSN All welded construction, Molded encapsulation, Wraparound terminations

PHOENIX CONTACT
2945396 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design.
2947925 Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. Height: 7.5 mm, width: 50 mm

Sangdest Microelectroni...
40CPQ015 High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance

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