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PACKAGING Datasheets, PDF

Descripción buscado : 'PACKAGING' - Total: 1093 (1/55) Page
Fabricante ElectrónicoNo. de piezavistaDescripción Electrónicos

Molex Electronics Ltd.
0903257016 1.27mm (.050) Pitch Picoflex® PF-50 Header, Vertical, Low Profile, with PCB Pegs, 16 Circuits, Tube Packaging
0879141416 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0747121008 6.25mm Pitch Ganged RF Header, Vertical, 6 Circuits, Long Tails, Without Packaging Header
0503509001 2.50mm / 3.00mm Pitch Wire-to-Board Female Crimp Terminal, Tin (SnOverall, 16-18 AWG, Reel Packaging, Lead-free
0536270474 0.635mm Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticaStacking, 10.00 and 16.00mm (.394 and Stacking Heights, Lead-free, 40Circuits, with Embossed Tape with Cover Packaging
0526101072 1.00mm Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 10 Circuits, Lead-free, High Barrier Packaging
0522072985 1.00mm Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 29 Circuits, Lead-free, High Barrier Packaging
0529010374 0.635mm Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, VerticalStacking, 11.00 to 16.00mm (.433 to Stacking Heights, Embossed Tape withCover Packaging, 30 Circuits, Lead-free

Intel Corporation
MCS-51 MCS-51 and MCS-96 Packaging Information

Taiyo Yuden (U.S.A.), I...
TMK042CG020CD-W Standard packaging quantity
HMK105B7472MV-F Standard packaging quantity
HMK212C7474MG-TE Standard packaging quantity (minimum) Taping Embossed 3000pcs

Torex Semiconductor
SOT-323 Packaging Information

MORNSUN Science& Techno...
URA2405LD-15WR2 DUAL/SINGLE OUTPUT DIP PACKAGING, DC-DC CONVERTER

Molex Electronics Ltd.
0879116811 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
0879114411 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
0878910206 2.54mm (.100) Pitch KK® Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray Packaging, Lead-free
0877581617 2.00mm (.079) Pitch Milli-Grid™ Header, Through Hole, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
0522073485 1.00mm Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 34 Circuits, Lead-free, High Barrier Packaging
0522712769 1.00mm Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 27 Circuits, Lead-free, High Barrier Packaging

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