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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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ENCAPSULATION Datasheet, PDF |
| Palabra clave buscada : 'encapsulation' - Total: 67 (2/4) Pages |
| Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
 Shanghai Leiditech Elec... |
HL16-400H | 
279Kb/1P |
Encapsulation material: flame-retardant epoxy powder, in line with UL94V-0 requirements |
 Sangdest Microelectroni... |
63CPQ080 |
141Kb/5P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance |
| 400CMQ |
210Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| MBR2535 |
204Kb/6P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| 303DMQ600 |
174Kb/3P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| 40CPQ015 |
129Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| MBRB10200CT |
262Kb/7P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| 87CNQ020 |
227Kb/5P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| 183NQ-1 |
184Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| 201CNQ |
209Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| 300CNQ |
213Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| 301CNQ |
206Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| 303CNQ |
211Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
| MBR2035 |
170Kb/6P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance | |
 PHOENIX CONTACT |
2946117 |
43Kb/2P |
Covering hood, for the contact and dust-protected encapsulation of the components, in green design. |
| 2948322 |
46Kb/2P |
Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. | |
| 2942768 |
47Kb/2P |
Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. | |
| 2943518 |
43Kb/2P |
Covering hood, for the contact and dust-protected encapsulation of the components, in green design. | |
| 2945396 |
47Kb/2P |
Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. | |
| 2943165 |
47Kb/2P |
Covering hood, for the contact and dust-protected encapsulation of the components, in transparent design. |
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