Fabricante Electrónico | No. de pieza | Datasheet | Descripción Electrónicos |
Renesas Technology Corp
|
AC10DSMA |
404Kb/8P |
10 A RESIN MOLD TYPE TRIAC April 1st, 2010 |
AVX Corporation
|
F98 |
87Kb/1P |
Resin-Molded Chip, High CV Frameless |
F93-AJ6 |
206Kb/4P |
Resin-Molded Chip - Automotive Product Range |
OSRAM GmbH
|
LOM676-Q2T1-24 |
511Kb/20P |
white SMT package, colorless clear resin |
LOQ976-PS-25 |
528Kb/20P |
SMT package 0603, colorless diffused resin |
LPM67K-D2G1-25 |
501Kb/20P |
white SMT package, colorless clear resin |
LGM67K-G1J2-24 |
501Kb/20P |
white SMT package, colorless clear resin |
SunLED Corporation
|
XZMOLA143S |
340Kb/7P |
White SMD package with silicone resin |
XZDG10X160S |
376Kb/9P |
White ceramic package with silicone resin |
HK TO-GRACE TECHNOLOGY ...
|
27-21-T3D-AP2Q2HY-3C |
909Kb/12P |
Chip LED with Right Angle Resin |
27-21-W1D-APQHY-3C |
902Kb/12P |
Chip LED with Right Angle Resin |
OSRAM GmbH
|
LG-T770 |
428Kb/19P |
white SMT package, colorless clear resin |
LO-A67K |
471Kb/19P |
white SMT package, colorless clear resin |
LW-M67C |
667Kb/23P |
white SMT package, colored diffused resin |
LT-T66G |
1Mb/22P |
black PLCC-2 package, colorless resin |
LY-A675 |
368Kb/15P |
white SMT package, colorless clear resin |
LY-P47F |
525Kb/22P |
white SMT package, colorless clear resin |
LS-M670 |
373Kb/15P |
white SMT package, colorless clear resin |
LSGA671 |
490Kb/15P |
white SMT package, colorless clear resin |
LGM676 |
502Kb/20P |
white SMT package, colorless clear resin |