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PLATING Datasheets, PDF

Descripción buscado : 'PLATING' - Total: 15089 (1/755) Page
Fabricante ElectrónicoNo. de piezavistaDescripción Electrónicos

Molex Electronics Ltd.
0702463401 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 34Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630129 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .180" Pocket, Shrouded, 25Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897720 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
15-80-0565 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630112 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .180" Pocket, Shrouded, 8Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897462 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 46 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
0702461001 2.54mm (.100") Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-1101 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-91-3103 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 10 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0740591002 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .180" Pocket, Shrouded, 21Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702472651 2.54mm (.100") Pitch C-Grid® Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0209 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
0010897460 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 46 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail

RMT Ltd.
1MC04-050-03 Blank ceramics (not metallized) Metallized (Au plating) Metallized (Au plating)

Molex Electronics Ltd.
0010897060 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 6 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
15-91-2155 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 15 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430118 2.54mm (.100") Pitch SL™ Header, Single Row, Vertical, .120" Pocket, Shrouded, 14 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-2165 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 16 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897102 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 10 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail
15-80-0685 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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