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PACKAGING Datasheets, PDF

Descripción buscado : 'PACKAGING' - Total: 1093 (1/55) Page
Fabricante ElectrónicoNo. de piezavistaDescripción Electrónicos

Taiyo Yuden (U.S.A.), I...
HMK325BJ225KM-P Standard packaging quantity
EMK042CG1R3AD-W Standard packaging quantity

Torex Semiconductor
USP-2B02 Packaging Information / Reference Pattern Layout Dimensions

MORNSUN Science& Techno...
VRA1205LD-15WR2 DUAL/SINGLE OUTPUT DIP PACKAGING,

Molex Electronics Ltd.
0879117811 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, 78 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
0878982066 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 20 Circuits, 2.50μm (98μ) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free
0903259006 1.27mm (.050) Pitch Picoflex® PF-50 Header, Vertical, Low Profile, 6 Circuits, Tin (Sn) Plating, Tube Packaging
0877581650 2.00mm (.079) Pitch Milli-Grid™ Header, Through Hole, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
0877581417 2.00mm (.079") Pitch Milli-Grid™ Header, Through Hole, Vertical, 14 Circuits, 0.76μm(30μ") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
0526101371 1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 13 CircuitsLead-free, High Barrier Packaging
0674921922 1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height3.55mm (.140"), 0.38μm (15μ") Gold (Au) Plating, without Cap, Embossed Tape onReel Packaging, 22 Circuits, Lead Free
0536250374 0.635mm (.025") Pitch SlimStack™ Header, Surface Mount, Dual Row, Vertical Stacking, 13.00mm (.512") Stack Height, Lead-free, 30 Circuits, with Embossed Tapewith Cover Packaging
0674921221 1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height6.74mm (.265"), 0.76μm (30μ") Gold (Au) Plating, Embossed Tape on Reel Packaging22 Circuits, Tape on Reel Packaging, Lead Free

Wolfson Microelectronic...
WAN-0165 Safe Handling and Packaging of Tape and Reel Product to be Returned

Taiyo Yuden (U.S.A.), I...
TMK042CG040BD-W Standard packaging quantity
HMK105CG390JV-F Standard packaging quantity
JMK325ABJ157MM-P Standard packaging quantity (minimum) Taping Embossed 1000pcs

Torex Semiconductor
SOT-563 Packaging Information / Reference Pattern Layout Dimensions

MORNSUN Science& Techno...
URA2405ZP-6WR2 DUAL/SINGLE OUTPUT DIP PACKAGING, DC-DC CONVERTER

Molex Electronics Ltd.
0878982026 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 20 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free

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