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PACKAGE Datasheets, PDF

Agilent(Hewlett-Packard)(34)Fairchild Semiconductor(57)FCI connector(1)Finisar Corporation.(18)First Components International(4)Formosa MS(2)Foshan Blue Rocket Electronics Co.,Ltd.(1724)Fox Electronics(2)Freescale Semiconductor, Inc(1)Fuji Electric(96)Fujikura Ltd.(4)Fujitsu Component Limited.(11)Future Technology Devices International Ltd.(1)FutureWafer Tech Co.,Ltd(11)Gamma Microelectronics Inc.(2)Gaomi Xinghe Electronics Co., Ltd.(1)GeneSiC Semiconductor, Inc.(15)Gilway Technical Lamp(1)Global Mixed-mode Technology Inc(157)Golledge Electronics Ltd(43)Grayhill, Inc(4)Green Power Solutions srl(4)GSI Technology(306)Hamamatsu Corporation(43)HB Electronic Components(2)Hi-Sincerity Mocroelectronics(2)Hitachi Semiconductor(1)HITRON ELECTRONICS CORPORTION(12)Holt Integrated Circuits(1)Holtek Semiconductor Inc(10)Honeywell Accelerometers(15)Honeywell Solid State Electronics Center(6)HuaXinAn Electronics CO.,LTD(2)HY ELECTRONIC CORP.(2)IDEA.lnc.(10)IK Semicon Co., Ltd(2)ILSI America LLC(81)Inchange Semiconductor Company Limited(41)Infineon Technologies AG(37)Integrated Circuit Solution Inc(1)Integrated Circuit Systems(1)Integrated Device Technology(8)Integrated Silicon Solution, Inc(3)Integrated Technology Future(1)Intel Corporation(4)InterFET Corporation(1)International Rectifier(161)Intersil Corporation(4)Intronics Power, Inc.(1)IQD Frequency Products Ltd(11)IRC - a TT electronics Company.(1)Ironwood Electronics.(2)Isahaya Electronics Corporation(2)ITT Industries(1)IXYS Corporation(38)Japan Aviation Electronics Industry, Ltd.(1)JDS Uniphase Corporation(2)JMK Inc.(2)SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD(28)
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Descripción buscado : 'PACKAGE' - Total: 12321 (1/617) Page
Fabricante ElectrónicoNo. de piezavistaDescripción Electrónicos

Sharp Electrionic Compo...
PC411L0YIP0F High Speed 15Mb/s, High CMR Mini-flat Package OPIC Mini-flat Package ∗OPIC

Shindengen Electric Mfg...
S15WB60_17 Square In-line Package (Input/Output In-line Package)

Texas Instruments
TDA2P-ACD_18 ADAS Applications Processor 23mm Package (ACD Package) Silicon Revision 1.0
TDA2P-ABZ ADAS Applications Processor 23mm Package (ABZ Package) Silicon Revision 1.0

Continental Device Indi...
TO-263 TO-263 D PAK SMD Plastic Package Package Outline and Packaging Information

Texas Instruments
TDA2EG-17 SoC for Advanced Driver Assistance Systems (ADAS) 17mm Package (CBD Package) Silicon Revision 2.0

Advanced Power Technolo...
APT5010B2VRG New T-MAX™ Package (Clip-mounted TO-247 Package)

Hamamatsu Corporation
S9648-100 Plastic package shaped the same as metal package

National Semiconductor ...
D16D 16 Lead Hybrid Metal Can Dual-in-Line Package NS Package Number D16D

Texas Instruments
TDA2HA-17 TDA2x ADAS Applications Processor 17mm Package (AAS Package) Silicon Revision 2.0

National Semiconductor ...
MC16A 16 Lead Ceramic Small Outline Package NS Package Number MC16A
MTC16 16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16

Zetex Semiconductors
SOD523 Surface mounted, 2 pin package Package outline

Integrated Circuit Syst...
MK2761A Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)

List of Unclassifed Man...

Texas Instruments
TDA2EG SoC for Advanced Driver Assistance Systems (ADAS) 23mm Package (ABC Package) Silicon Revision 2.0
TDA2P-ABZ_19 Applications Processor 23mm Package (ABZ Package) Silicon Revision 1.0

Vectron International, ...
C4550 OCXO Surface Mount Package Optional Reflow Process Compatible Optional AT-Cut and SC-Cut Crystal Options Low Profile Compact Package
C4505 OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Compact Package

Integrated Circuit Solu...
ICS280 Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body)

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