PACKAGE Datasheet(PDF) - NR8501 - California Eastern Labs

Motor de Búsqueda de Datasheet de Componentes Electrónicos

ALLDATASHEET.ES

X

PACKAGE Datasheet, PDF

: ALL A-BRIGHT Inc(45)ABLIC Inc.(10)Abracon Corporation(23)ACCUTEK MICROCIRCUIT CORPORATION(8)ACE Technology Co., LTD.(1)Actel Corporation(3)Acutechnology Semiconductor(10)Advanced Analog Technology, Inc.(2)Advanced Analogic Technologies(8)Advanced Crystal Technology(10)Advanced Micro Devices(14)Advanced Photonix, Inc.(24)Advanced Power Electronics Corp.(112)Advanced Power Technology(2)Advanced Semiconductor(4)Advanced Technical Materials Inc.(1)Advanced Thermal Solutions, Inc.(14)Advanced XTAL Products(87)Advantech Co., Ltd.(5)Aeroflex Circuit Technology(3)Agilent(Hewlett-Packard)(34)AIMTEC(1)AiT Semiconductor Inc.(3)All Sensors Corporation(6)Allegro MicroSystems(19)Allen-Bradley(1)Alliance Semiconductor Corporation(17)Allied Components International(3)Alpha & Omega Semiconductors(89)ALPS ELECTRIC CO.,LTD.(2)Altera Corporation(5)AMAZING Microelectronic Corp.(37)American Accurate Components, Inc.(5)American Microsemiconductor(52)AMIC Technology(4)Amkor Technology(21)Amphenol Corporation(4)Analog Devices(82)Analog Intergrations Corporation(1)Analog Microelectronics(1)Anaren Microwave(5)Anpec Electronics Coropration(2)Anshan Suly Electronics(1)API Delevan(3)Aries Electronics, Inc.(4)Asahi Kasei Microsystems(35)Astec America, Inc(2)ATMEL Corporation(3)AVAGO TECHNOLOGIES LIMITED(127)AVG Semiconductors(HITEK)(1)Avic Technology(1)AVX Corporation(1)BCM Advanced Research.(1)Bel Fuse Inc.(17)BetLux Electronics(15)Bi technologies(3)Bivar, Inc.(193)Bolymin, Inc(73)Bothhand USA, LP.(6)Bourns Electronic Solutions(9)BRIGHT LED ELECTRONICS CORP(41)Broadcom Corporation.(76)Bruckewell Technology LTD(2)Bud Industries, Inc.(1)C&D Technologies(1)C&K Components(3)California Eastern Labs(72)California Micro Devices Corp(9)CAMBION Electronic Components(4)Catalyst Semiconductor(3)Central Semiconductor Corp(39)Chicago Miniature Lamp,inc(9)CITIZEN ELECTRONICS CO., LTD.(98)Clairex Technologies, Inc(11)CML Microcircuits(3)Compensated Deuices Incorporated(4)Connor-Winfield Corporation(1)Continental Device India Limited(56)COSMO Electronics Corporation(23)Cree, Inc(1)Crydom Inc.,(5)Crystek Corporation(1)CTS Corporation(5)CUI INC(3)Cypress Semiconductor(4)Cystech Electonics Corp.(3)DAICO Industries, Inc.(1)Dallas Semiconductor(4)Datatronic Distribution, Inc.(3)DB Lectro Inc(14)Delta Electronics, Inc.(65)Dialight Corporation(13)Dialog Semiconductor(2)DinTek Semiconductor Co,.Ltd(1)Diodes Incorporated(37)DIYI Electronic Technology Co., Ltd.(2)E&E Magnetic Products Limited(3)E-SWITCH(45)E-Tech Electronics LTD(3)Ecliptek Corporation(1)ECS, Inc.(4)EHAOAN.(40)Elantec Semiconductor(1)Elite Enterprises (H.K.) Co., Ltd.(1)ELM Electronics(2)ELM Technology Corporation(34)Emerson Network Power(4)Enpirion, Inc.(1)Eon Silicon Solution Inc.(3)EPCOS(2)Epson Company(2)ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD.(1)ETA SOLUTIONS CO. LIMITED(6)EUROQUARTZ limited(9)Eutech Microelectronics Inc(6)Everlight Electronics Co., Ltd(389)Exar Corporation(2)
: More Close

Palabra clave buscada : 'PACKAGE' - Total: 72 (1/4) Pages

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
California Eastern Labs	NR8501	240Kb/6P	InGaAs APD IN COAXIAL PACKAGE FOR 2.5Gb/s APPLICATIONS
	NX6510GH	946Kb/6P	LASER DIODE IN COAXIAL PACKAGE FOR FIBER OPTIC COMMUNICATIONS
	NX7304BG	96Kb/4P	LASER DIODE IN COAXIAL PACKAGE FOR FIBER OPTIC COMMUNICATIONS
	NR8360JP-BC	85Kb/2P	30 um InGaAs APD IN DIP PACKAGE FOR OTDR APPLICATION
	PS2911-1-F3-M-A	494Kb/13P	HIGH CTR, 4-PIN ULTRA SMALL PACKAGE FLAT-LEAD PHOTOCOUPLER
	PS2911	766Kb/7P	NECs HIGH CTR, 4 PIN ULTRA SMALL PACKAGE FLAT LEAD OPTOCOUPLER
	NR7500	195Kb/5P	InGaAs PIN-PD IN COAXIAL PACKAGE FOR 2.5 Gbp/s APPLICATIONS
	NX7561	185Kb/4P	NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX7529	190Kb/4P	NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX8304BE-CC	105Kb/5P	InGaAsP MQW-DFB LASER DIODE IN COAXIAL PACKAGE FOR FIBER OPTIC COMMUNICATIONS
	NX7661	185Kb/4P	NECs 1625 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX7528	190Kb/4P	NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX7302BA-CC	101Kb/4P	InGaAsP MQW FP LASER DIODE IN COAXIAL PACKAGE FOR 622 Mb/s APPLICATIONS
	NX8300BE-CC	125Kb/5P	InGaAsP MQW DFB LASER DIODE IN COAXIAL PACKAGE FOR 2.5 Gb/s APPLICATION
	NX7303BA	100Kb/4P	InGaAsP MQW FP LASER DIODE IN COAXIAL PACKAGE FOR 155 Mb/s APPLICATION
	NE38018	68Kb/9P	GaAs HJ-FET L TO S BAND LOW NOISE AMPLIFIER (New Plastic Package)
	NE34018	200Kb/10P	GaAs HJ-FET L TO S BAND LOW NOISE AMPLIFIER (New Plastic Package)
	NR4500BP	98Kb/3P	InGaAs APD WITH INTERNAL PREAMPLIFIER IN COAXIAL PACKAGE FOR 2.5 Gb/s APPLICATIONS
	NR8501BP	241Kb/6P	NECs 50 關m InGaAs APD IN COAXIAL PACKAGE FOR 2.5Gb/s APPLICATIONS
	NR4500BP-CC	98Kb/3P	InGaAs APD WITH INTERNAL PREAMPLIFIER IN COAXIAL PACKAGE FOR 2.5 Gb/s APPLICATIONS

1 2 3 4 >

1 2 3 4 >

¿Qué es PACKAGE

En las piezas electrónicas, el paquete significa un estuche o paquete utilizado para proteger y conectar dispositivos.

El paquete juega un papel importante en la protección y la conexión de dispositivos.

Si el dispositivo no está protegido correctamente, las influencias ambientales pueden dañar o destruir el dispositivo.

El paquete viene en varias formas y tamaños, y hay varios tipos según el tipo y el propósito del dispositivo.

Los paquetes representativos incluyen DIP (paquete dual en línea), SOP (paquete de línea pequeña), QFP (paquete quad plano) y BGA (matriz de cuadrícula de bola).

Una caída es uno de los paquetes más representativos y tiene dos pines colocados en línea.

Los SOP son paquetes más pequeños que las caídas y tienen una forma rectangular.

QFP es un paquete con pines paralelos a la circunferencia del paquete, y BGA es un paquete en el que se perforan pequeños agujeros en la parte inferior de los elementos y se unen pequeñas cuentas para conectar los elementos.

Dependiendo de las características de cada paquete, se utiliza para varios fines.

Por ejemplo, los DIP generalmente se usan para circuitos integrados de baja densidad, y los BGA se usan para circuitos integrados de alta densidad.

*Esta información es solo para fines informativos generales, no seremos responsables de ninguna pérdida o daño causado por la información anterior.

Política de Privacidad

ALLDATASHEET.ES

¿ALLDATASHEET es útil para Ud.? [ DONATE ]

Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Intercambio de Enlaces | Lista de Fabricantes
All Rights Reserved©Alldatasheet.com

Mirror Sites English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz

Family Site : ic2ic.com | icmetro.com