Motor de Búsqueda de Datasheet de Componentes Electrónicos
  Spanish  ▼
ALLDATASHEET.ES

X  



PACKAGE Datasheet, PDF

P-tec Corporation(550)Pan Jit International Inc.(8)Panasonic Battery Group(8)Panasonic Semiconductor(27)PANDUIT CORP.(1)Pasternack Enterprises, Inc.(74)PCA ELECTRONICS INC.(8)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(13)PETERMANN-TECHNIK(14)PhaseLink Corporation(1)PHOENIX CONTACT(10)Pletronics, Inc.(1)Polyfet RF Devices(1)Power-One(8)Premier Magnetics, Inc.(9)Protek Devices(9)Pulse A Technitrol Company(5)Purdy Electronics Corporation(25)Qorvo, Inc(2)QT Optoelectronics(1)Quantum Research Group(1)QUARTZCOM the communications company(14)Quectel Wireless Solutions Co., Ltd.(2)Quelighting Corp(8)Raltron Electronics Corporation(6)RCD COMPONENTS INC.(1)Recom International Power(25)Rectron Semiconductor(11)Renesas Technology Corp(20)RF Micro Devices(2)RF Monolithics, Inc(26)RFHIC(9)Rhombus Industries Inc.(20)Richtek Technology Corporation(15)RICOH electronics devices division(3)Rochester Electronics(4)Rohm(65)Roithner LaserTechnik GmbH(28)RSG Electronic Components GmbH(7)Sames(1)Samsung semiconductor(5)Sangdest Microelectronic (Nanjing) Co., Ltd(7)Sanken electric(9)SanRex Corporation(6)Sanyo Semicon Device(9)SCHOTT CORPORATION(5)Seiko Instruments Inc(26)Seme LAB(528)Semtech Corporation(2)SEMTECH ELECTRONICS LTD.(1)Sensitron(3)Sensortechnics GmbH(3)Seoul Semiconductor(44)SGX Sensortech(2)Shanghai awinic technology co.,ltd(3)SHANGHAI BELLING CO., LTD.(1)Shanghai Leiditech Electronic Technology Co., Ltd(35)Shanghai Semitech Semiconductor Co., Ltd(12)SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD(28)Sharp Corporation(104)SHENZHEN FUMAN ELECTRONICS CO., LTD.(1)Shenzhen Huazhimei Semiconductor Co., Ltd(4)Shenzhen Luguang Electronic Technology Co., Ltd(8)SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.(3)SHENZHEN YONGERJIA INDUSTRY CO.,LTD(1)SHIKUES Electronics(14)Shindengen Electric Mfg.Co.Ltd(41)Shoulder Electronics Limited.(2)Shunye Enterprise(1)Siemens Semiconductor Group(49)Silan Microelectronics Joint-stock(4)Silicon Laboratories(3)Silonex Inc.(8)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(4)Skyworks Solutions Inc.(16)SMSC Corporation(8)Solid State Optronic(53)Solid States Devices, Inc(12)Solitron Devices Inc.(1)SPANSION(19)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(14)Stanson Technology(8)StarHope(1)STATEK CORPORATION(1)STATS ChipPAC, Ltd.(1)STMicroelectronics(664)SunLED Corporation(295)Surge Components(3)Suzhou HangJing Electronic Technology Co., LTD(47)SynQor Worldwide Headquarters(3)TAI-SAW TECHNOLOGY CO., LTD.(2)TAITRON Components Incorporated(8)Taiwan Semiconductor Company, Ltd(4)Tak Cheong Electronics (Holdings) Co.,Ltd(47)TE Connectivity Ltd(5)Teccor Electronics(1)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(4)TEMEX(4)TEMIC Semiconductors(3)Texas Instruments(276)Texas Instruments(304)THine Electronics, Inc.(5)Thinki Semiconductor Co., Ltd.(35)Torex Semiconductor(7)Toshiba Semiconductor(21)Total Power International(37)Transcom, Inc.(2)Transko Electronics, Inc.(10)TRANSYS Electronics Limited(1)TriQuint Semiconductor(12)TT Electronics.(34)TXC Corporation.(10)Tyco Electronics(19)
More
Palabra clave buscada : 'PACKAGE' - Total: 49 (1/3) Pages
Fabricante ElectrónicoNo. de piezaDatasheetDescripción Electrónicos
Company Logo Img
Siemens Semiconductor G...
STL39002Z Datasheet pdf image
58Kb/3P
IRED in TO-Package
SRD00111Z Datasheet pdf image
119Kb/5P
Silicon PIN Photodiode in TO-Package
STH81002Z Datasheet pdf image
43Kb/3P
1550nm Laser in Coaxial TO-Package
STH51002Z Datasheet pdf image
43Kb/3P
1300nm Laser in Coaxial TO-Package
BXY42BA-6 Datasheet pdf image
31Kb/2P
Silicon PIN Diode (Fast switching Coax package)
BXY42BA-5 Datasheet pdf image
28Kb/2P
Silicon PIN Diode (Fast switching Coax package)
STL51007X Datasheet pdf image
80Kb/4P
1300 nm Laser in Receptacle Package, Low Power
STM51004X Datasheet pdf image
128Kb/4P
1300 nm Laser in Receptacle Package, Medium Power
STL81007X Datasheet pdf image
550Kb/4P
1550 nm Laser in Receptacle Package, Low Power
SRD00231Z Datasheet pdf image
66Kb/3P
Ternary PIN Photodiode in TO-Package, Central Pin
SRD00212Z Datasheet pdf image
64Kb/3P
Ternary PIN Photodiode in TO-Package with Integrated Optics
SRD00512Z Datasheet pdf image
75Kb/4P
Ge-Avalanche Photodiode in TO Package with Integrated Optics
KT100 Datasheet pdf image
34Kb/2P
Silicon Spreading Resistance Temperature Sensor in Leaded Plastic Package
KT110 Datasheet pdf image
12Kb/2P
Silicon Spreading Resistance Temperature Sensor in Miniature Leaded Plastic Package
STL81004X Datasheet pdf image
129Kb/4P
1550 nm Laser in Coaxial Package with SM-Pigtail, Low Power
STH51004X Datasheet pdf image
128Kb/4P
1300 nm Laser in Coaxial Package with SM-Pigtail, High Power
STL51004X Datasheet pdf image
129Kb/4P
1300 nm Laser in Coaxial Package with SM-Pigtail, Low Power
STM81004X Datasheet pdf image
129Kb/4P
1550 nm Laser in Coaxial Package with SM-Pigtail, Medium Power
BXY42BA-3 Datasheet pdf image
17Kb/2P
Silicon PIN Diode (Fast switching In stripline package other lead configurations available)
SFH420 Datasheet pdf image
48Kb/5P
GaAs-IR-Lumineszenzdiode in SMT-Gehause GaAs Infrared Emitter in SMT Package

1 2 3 >


1 2 3 >



¿Qué es PACKAGE


En las piezas electrónicas, el paquete significa un estuche o paquete utilizado para proteger y conectar dispositivos.

El paquete juega un papel importante en la protección y la conexión de dispositivos.

Si el dispositivo no está protegido correctamente, las influencias ambientales pueden dañar o destruir el dispositivo.

El paquete viene en varias formas y tamaños, y hay varios tipos según el tipo y el propósito del dispositivo.

Los paquetes representativos incluyen DIP (paquete dual en línea), SOP (paquete de línea pequeña), QFP (paquete quad plano) y BGA (matriz de cuadrícula de bola).

Una caída es uno de los paquetes más representativos y tiene dos pines colocados en línea.

Los SOP son paquetes más pequeños que las caídas y tienen una forma rectangular.

QFP es un paquete con pines paralelos a la circunferencia del paquete, y BGA es un paquete en el que se perforan pequeños agujeros en la parte inferior de los elementos y se unen pequeñas cuentas para conectar los elementos.

Dependiendo de las características de cada paquete, se utiliza para varios fines.

Por ejemplo, los DIP generalmente se usan para circuitos integrados de baja densidad, y los BGA se usan para circuitos integrados de alta densidad.

*Esta información es solo para fines informativos generales, no seremos responsables de ninguna pérdida o daño causado por la información anterior.


Enlace URL :

Política de Privacidad
ALLDATASHEET.ES
¿ALLDATASHEET es útil para Ud.?  [ DONATE ] 

Todo acerca de Alldatasheet   |   Publicidad   |   Contáctenos   |   Política de Privacidad   |   Intercambio de Enlaces   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com