BUILT-IN Datasheet(PDF) - LV5052V - ON Semiconductor

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BUILT-IN Datasheet, PDF

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Palabra clave buscada : 'BUILT-IN' - Total: 151 (1/8) Pages

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
ON Semiconductor	LV5052V	104Kb/9P	DC/DC Converter Controller Built-in 2-channels August, 2013
	LC75106V-TLM-H	188Kb/15P	Digital Echo LSI with Built-in Mic Amplifier June, 2013
	LV49157V	656Kb/30P	1ch DC/DC boost converter with built-in Headphone Amplifier June, 2013
	FSA2147	540Kb/12P	Low-Voltage, DPST Analog Switch Negative Signal Capability and Built-in Termination July 2009 Rev. 1.0.1
	ULPMC10	159Kb/19P	Struix System-in-Package July, 2015 ??Rev. 4
	BUL642D2	101Kb/8P	High Speed, High Gain Bipolar NPN Transistor with Integrated Collector?묮mitter and Built?뭝n Efficient Antisaturation Network August, 2005 ??Rev. 1
	SZESD9901	276Kb/6P	ESD Protection - In-Vehicle Networks July, 2021 - Rev. 1
	LB11899J	352Kb/16P	Three-in-One Motor Driver October, 2013
	NCP5203	69Kb/10P	2-in-1 DDR Power Controller January, 2005 ??Rev. 1
	CSPESD304	249Kb/5P	4-Channel ESD Array in CSP May, 2011 ??Rev. 3
	RSL10SIP	1Mb/20P	Bluetooth 5 System-in-Package (SiP) May, 2020 ??Rev. 1
	CM1204	311Kb/9P	4-Channel ESD Array in CSP April 2010 ??Rev. 3
	CM1244	206Kb/7P	4-Channel ESD Array in CSP April 2010 ??Rev. 3
	NCP5214	89Kb/14P	2-in-1 Notebook DDR Power Controller April, 2005 ??Rev. P0
	PACDN1408CG	112Kb/5P	ESD Protection Arrays in Chip Scale Package October, 2011 ??Rev. 4
	1SMF5920B	61Kb/4P	2.5 Watt Zener Diode in Flat Lead Package August, 2014 ??Rev. 0
	1SMF5920BT1G	107Kb/4P	2.5 Watt Zener Diode in Flat Lead Package October 2010 ??Rev. P0
	MM74HC164	278Kb/9P	8-Bit Serial-in/Parallel-out Shift Register February 2008 Rev. 1.5.0
	MM74HCT164	183Kb/9P	8-Bit Serial-in/Parallel-out Shift Register Revised February 2002
	CM1242-07CP	150Kb/5P	1-Channel ESD Protection Device in 0201 CSP April 2010 ??Rev. 1

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¿Qué es BUILT-IN

En los componentes electrónicos, el incorporado generalmente significa integrado dentro de un dispositivo o equipo.

Por ejemplo, en el caso de un teléfono inteligente, hay varios componentes incorporados, como cámaras, sensores, altavoces y micrófonos.

Los componentes incorporados se configuran de varias maneras de acuerdo con el tamaño y la función del dispositivo.

En la mayoría de los dispositivos, los componentes incorporados están pre-diseñados y se utilizan para mejorar la funcionalidad general y el rendimiento del dispositivo.

Dado que los componentes incorporados no necesitan estar conectados a otras partes, se pueden reducir los errores o la atenuación de la señal debido a la conexión entre las piezas.

Además, los componentes incorporados están protegidos en el exterior del instrumento, aumentando la durabilidad y la confiabilidad.

Los componentes incorporados también pueden aumentar la conveniencia y la eficiencia.

Por ejemplo, en el caso de un teléfono inteligente, puede usar la cámara incorporada para tomar una imagen, y el sensor incorporado se puede usar para detectar la orientación del dispositivo.

Estos componentes incorporados permiten el uso conveniente de varias funciones.

*Esta información es solo para fines informativos generales, no seremos responsables de ninguna pérdida o daño causado por la información anterior.

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