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PACKAGING Datasheets, PDF

Descripción buscado : 'PACKAGING' - Total: 1093 (1/55) Page
Fabricante ElectrónicoNo. de piezavistaDescripción Electrónicos

Molex Electronics Ltd.
0479890112 1.00mm (.039") by 1.00mm (.039") Pitch rPGA 989 Notebook PC CPU Socket, with Mylar, Hard Tray Packaging, 989 Circuits, Lead free
0874272242_18 Mini-Fit Jr. Header, 4.20mm Pitch, Vertical, Nylon, without Flange, 22Circuits, Tin (Sn)over Nickel (Ni) Plating, Bulk Packaging

Taiyo Yuden (U.S.A.), I...
TMK042CG0R6CD-W Standard packaging quantity
TMK021CG020BK-W Standard packaging quantity

Texas Instruments
TPS62671_16 500-mA/650-mA, 6-MHz High-Efficiency Step-Down Converter in Low Profile Chip Scale Packaging (Height < 0.4mm)

CTS Corporation
753081103GP High Density Packaging

Vishay Siliconix
SS23-E3 Packaging Information

Molex Electronics Ltd.
0879113811 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
0879142815 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
0878980554 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tape on Reel Packaging, with Cap, Lead-free
0877585016 2.00mm (.079) Pitch Milli-Grid™ Header, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
0550910874 0.635mm (.025") Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 6.00 and 12.00mm (.236 and .472") Stacking Heights, Black, Lead-free, 80Circuits, Robotic Placement Metal Cap, with Embossed Tape on Reel Packaging
0536251474 0.635mm (.025") Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 13.00mm (.512") Stack Height, Lead-free, 140 Circuits, with Embossed Tapewith Cover Packaging
0522073060 1.00mm (.039") Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 30 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
0529011074 0.635mm (.025") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical Stacking, 11.00 to 16.00mm (.433 to .630") Stacking Heights, Embossed Tape withCover Packaging, 100 Circuits, Lead-free
0358573049 1.00mm (.039") Pitch FFC Connector, Vertical, Non-ZIF, 30 Circuits, Tube Packaging
0874271242_18 Mini-Fit Jr. Header, 4.20mm Pitch, Vertical, Nylon, without Flange, 12 Circuits, Tin (Sn) over Nickel (Ni) Plating, Bulk Packaging

Taiyo Yuden (U.S.A.), I...
JMK042BJ473MC-W Standard packaging quantity
EMK042CG5R8BD-W Standard packaging quantity

M/A-COM Technology Solu...
MAAD-007083 Tape and Reel Packaging Available

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